In the virtual design development and performance assessment of polymer and polymer composite components the materials complexity necessitate sophisticated approaches and methods. Besides some general methods some solutions need to be specifically developed for defined applications. In most cases the resulting methods are routines based on algorithms developed within the group used in interaction with a finite element solver. Challenges which are worked on are for example
Multi-scale modeling
Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T., Qi, T.: Finite Element Analysis of Arbitrarily Complex Electronic Devices. IEEE 18th Electronics Packaging Technology Conference (EPTC) , 497–500
Failure and lifetime prediction
Fellner, K., Antretter, T., Fuchs, P.F., Tao, Q.: Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads. Microelectronics Reliability 62, 148–155 (2016). doi: 10.1016/j.microrel.2016.03.034
Process induced component performance influences
Mario Gschwandl, Peter Filipp Fuchs, Ivaylo Mitev, Mahesh Yalagach, Thomas Antretter, Tao Qi, Angelika Schingale: Modeling of Manufacturing Induced Residual Stresses of Viscoelastic Epoxy Mold Compound Encapsulations. IEEE 19th Electronics Packaging Technology Conference (EPTC) . Accessed 19 January 2018
Fracture and Delamination
Fuchs, P.F., Major, Z.: Experimental Determination of Cohesive Zone Models for Epoxy Compo-sites. Exp Mech 51(5), 779–786 (2011). doi: 10.1007/s11340-010-9370-2
Special Test Set Ups
Fuchs, P.F., Pinter, G., Krivec, T.: Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions. EuroSimE 2014. doi: 10.1109/EuroSimE.2014.6813787
Metamaterials
Mansouri, M.R., Montazerian, H., Schmauder, S., Kadkhodapour, J.: 3D-printed multimaterial composites tailored for compliancy and strain recovery. Composite Structures 184, 11–17 (2018). doi: 10.1016/j.compstruct.2017.09.049
Micromechanis
Fuchs, P., Pinter, G., Tonjec, M.: Determination of the orthotropic material properties of individual layers of printed circuit boards. Microelectronics Reliability 52(11), 2723–2730 (2012). doi: 10.1016/j.microrel.2012.04.019
